• <tr id='z3eJjV'><strong id='z3eJjV'></strong><small id='z3eJjV'></small><button id='z3eJjV'></button><li id='z3eJjV'><noscript id='z3eJjV'><big id='z3eJjV'></big><dt id='z3eJjV'></dt></noscript></li></tr><ol id='z3eJjV'><option id='z3eJjV'><table id='z3eJjV'><blockquote id='z3eJjV'><tbody id='z3eJjV'></tbody></blockquote></table></option></ol><u id='z3eJjV'></u><kbd id='z3eJjV'><kbd id='z3eJjV'></kbd></kbd>

    <code id='z3eJjV'><strong id='z3eJjV'></strong></code>

    <fieldset id='z3eJjV'></fieldset>
          <span id='z3eJjV'></span>

              <ins id='z3eJjV'></ins>
              <acronym id='z3eJjV'><em id='z3eJjV'></em><td id='z3eJjV'><div id='z3eJjV'></div></td></acronym><address id='z3eJjV'><big id='z3eJjV'><big id='z3eJjV'></big><legend id='z3eJjV'></legend></big></address>

              <i id='z3eJjV'><div id='z3eJjV'><ins id='z3eJjV'></ins></div></i>
              <i id='z3eJjV'></i>
            1. <dl id='z3eJjV'></dl>
              1. <blockquote id='z3eJjV'><q id='z3eJjV'><noscript id='z3eJjV'></noscript><dt id='z3eJjV'></dt></q></blockquote><noframes id='z3eJjV'><i id='z3eJjV'></i>
                PRODUCTS & SERVICES

                HDI PCBs HDI

                HDI PCB

                HDI, High Density Interconnect, with microvia≤0.15mm, use fine feature technology to connect components in small packages. HDI’s smaller geometry’s allow for higher wiring density. The electrical performance is greatly improved because of control on lower parasitic, minimal stubs, removal of decoupling capacitors and lower crosstalk. RFI and EMI is much lower due to ground planes being closer together, distributed capacitance is closer.

                Kinwong capabilities are as follows:

                • Increasing the wiring density
                • Facilitates the use of advanced packaging technology
                • Can improve radio frequency interference / electromagnetic wave interference / electrostatic discharge (RFI/EMI/ESD)
                • Any-layer (2021, Zhuhai)
                • mSAP (2023, Zhuhai)
                • Advanced equipment
                • Min. trace width/spacing: 0.04mm/0.04mm (2021, Zhuhai)
                • Max. solder mask registration tolerance+/-1mil

                For more information about Kinwong’s capabilities, please contact one of our Field Application Engineers